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塑料微流控芯片键合前的预联接方法和装置

Release Time:2022-10-20  Hits:

First Author: 王立鼎

Disigner of the Invention: Chong Liu,王晓东,罗怡,Chu Jinkui,刘军山,廖俊峰,温敏

Institution: 机械工程学院

Application Number: CN1548361

Authorization Number: CN03111669.8

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