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AlN陶瓷基板材料热导率与烧结助剂的研究进展

Release Time:2019-03-12  Hits:

Indexed by: Journal Article

Date of Publication: 2009-01-01

Journal: 材料导报

Included Journals: ISTIC、PKU

Volume: 23

Issue: 9

Page Number: 56-62

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