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个人信息Personal Information
副教授
硕士生导师
性别：男
毕业院校：山东大学
学位：博士
所在单位：材料科学与工程学院
学科：材料加工工程. 材料表面工程
联系方式：xmpan@dlut.edu.cn
电子邮箱：xmpan@dlut.edu.cn
The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction
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论文类型：会议论文
发表时间：2008-01-01
收录刊物：CPCI-S
卷号：98
摘要：Two lead-free solder alloys, Sn-0.7Cu and Sn-2Cu (wt.%), have been examined using X-ray diffraction method. The liquid structure of Sn-0.7Cu is similar to that of pure Sn. A pre-peak has been found in the low Q part on the structure factor S(Q) for Sn-2Cu tested under 260 degrees C, but it disappeared finally when the testing temperature reached 400 degrees C. The interfacial reactions between liquid solders and Cu substrates at 260 degrees C were also studied. The results show that the IMC layer at Sn-2Cu/Cu joint is thicker than that at Sn-0.7Cu/Cu interface. The correlative effect of liquid structure on phase evolution in the solder joints are analyzed and discussed.