个人信息Personal Information
副教授
硕士生导师
性别:男
毕业院校:山东大学
学位:博士
所在单位:材料科学与工程学院
学科:材料加工工程. 材料表面工程
联系方式:xmpan@dlut.edu.cn
电子邮箱:xmpan@dlut.edu.cn
Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder
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论文类型:期刊论文
发表时间:2015-01-01
发表刊物:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
收录刊物:SCIE、EI、Scopus
卷号:26
期号:1
页面范围:345-352
ISSN号:0957-4522
摘要:The effects of trace RE Ce addition on the microstructure, melting point and wettability of eutectic Sn-0.7Cu solder as well as on the interfacial reactions of Sn-0.7Cu-xCe/Cu(Ni) during soldering were investigated. The Ce bearing solders owned slightly higher melting temperatures than eutectic Sn-0.7Cu solder, with small melting intervals. The addition of trace RE Ce had a diverse effect on the wettability of the solders, and better wettability was obtained on Cu substrate than on Ni substrate. Due to the metamorphism of RE elements, the beta-Sn dentrites were refined and the eutectic regions became more uniform in the Sn-0.7Cu-xCe solders with the increase of Ce addition. The intermetallic compound (IMC) formed at Sn-0.7Cu-xCe/Cu interfaces during soldering was scallop-like Cu6Sn5, and those formed at Sn-0.7Cu-xCe/Ni interfaces were (Ni,Cu)(3)Sn-4 and (Cu,Ni)(6)Sn-5. With the increase of Ce addition, the average size, the aspect ratio and the thickness of the Cu6Sn5 grains on the Cu substrate decreased, while those of the IMC grains on the Ni substrate increased. The different growth behavior of the interfacial IMCs on Cu and Ni substrates were discussed.