Hits:
First Author:Wang Qing
Disigner of the Invention:Li Xiaohui
Authorization number:ZL201410588827.9
Pre One:一种用于缓控释给药的软膏组合基质
Next One:一种苯乙烯-异戊二烯-苯乙烯嵌段聚合物接枝环氧乙烯醚热塑弹性体及两亲性热熔压敏胶