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基于压力自适应的聚合物微器件超声波精密联接

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Indexed by:期刊论文

Date of Publication:2010-01-01

Journal:光学精密工程

Included Journals:PKU、ISTIC

Volume:18

Issue:5

Page Number:1189-1195

Pre One:Study on ultrasonic fusion bonding for polymer microfluidic chips

Next One:Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices
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