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一种基于温度补偿的无导能筋聚合物超声波键合方法

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First Author:Luo Yi

Disigner of the Invention:张宗波,郑英松,wangxiaodong,张彦国,wangliding

Application Number:CN200910303436.7

Authorization Date:2009-06-19

Authorization number:CN101607688

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