点击次数：

论文类型：期刊论文

发表时间：2016-03-01

发表刊物：Optoelectronics Letters

收录刊物：EI、Scopus

卷号：12

期号：2

页面范围：124-127

ISSN号：16731905

摘要：Micro vapor chamber (MVC) for light emitting diodes (LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper (Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0   C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs. ? 2016, Tianjin University of Technology and Springer-Verlag Berlin Heidelberg.