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论文类型：期刊论文

发表时间：2015-05-01

发表刊物：MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

收录刊物：SCIE、EI、Scopus

卷号：21

期号：5,SI

页面范围：1101-1110

ISSN号：0946-7076

摘要：A new technique was developed for embossing microstructures on thermoplastic substrates, which can achieve high accuracy replication with little loss of the production efficiency. The technique is no need of the preheating process and cooling device. In the new technique, just the surface layer of the polymer substrate was heated through heat transmission and ultrasonic viscoelastic heating was the major heat source. For our new technology, the temperature of the mould just provided the initial temperature of the mould-substrate interface and a higher boundary temperature for embossing. The replication accuracies of three embossing technologies were contrasted, including ultrasonic embossing at room temperature (HER), thermal assisted ultrasonic embossing (TUE) and local thermal assisted ultrasonic embossing (L-TUE). The results indicated that, the replication accuracy of L-TUE was approximate with TUE. Moreover, the effects of the processing parameters on the replication quality, including average replication depth and uniformity over the entire chip, were investigated. Different with our prediction, the replication accuracy did not monotonously improved with the ultrasonic force and the temperature of the mold. Finally, the temperature test was carried out to study the temperature characteristic of our new technology.