点击次数：

论文类型：会议论文

发表时间：2006-06-27

收录刊物：Scopus、CPCI-S、EI

页面范围：59-+

摘要：Three lead-free solder alloys, Sn-3Ag-0.5Cu, Sn-3Ag0.5Cu-1Bi and Sn-3Ag-0.5Cu-3Bi, were used in the current experiments to investigated the microstructural evolution as well as the kinetics of intermetallic compound(IMC) layer growth. The experimental results indicated that the thickness of Cu6Sn5 intermetallic layer, at the solder/Cu interface increases with aging temperature, while the growth rate of IMC in Sn-3Ag0.5Cu-3Bi/Cu joints is slower than that in Sn-3Ag-0.5Cu1Bi/Cu joints and Sn-Ag-Cu solder joints. The effect of Bi element is attributed to the accumulation of Bi near the joint and the enhancement of the activation energy by the addition of Bi.