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论文类型：期刊论文

发表时间：2009-04-03

发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物：EI、SCIE

卷号：473

期号：1-2

页面范围：382-388

ISSN号：0925-8388

关键字：Kinetics; Intermetallic; Shear strength; Solder

摘要：Three lead-free solder alloys, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1 Bi and Sn-3Ag-0.5Cu-3Bi, have been used to solder with Cu substrate in the current experiments to investigate the influence of Bi on the kinetics of intermetallic compound (IMC) layer growth and shear strength of the soldering couples. The experimental results indicate that the thickness of IMC layer at the solder/Cu interface increases with aging process. The addition of Bi delays the propagation rate of total IMC layer. For the samples aged at 140 degrees C up to 500 h. their shear strengths keep at a relative stable level where the fracture occurs in bulk solder side and the addition of Bi improve the strength level, while for the samples aged at 195 degrees C, the shear strengths decrease continuously with aging time where the fracture occurs along interface between IMC layers and solders and the influence of Bi can be negligible. (C) 2008 Elsevier B.V. All rights reserved.