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Indexed by:会议论文
Date of Publication:2015-08-16
Page Number:128-128
Key Words:料流;光整加工;黏弹性模型;工件表面;不一致性;剪切稀化;材料去除机理;
Abstract:将黏弹性模型引入到磨料流加工材料去除机理研究中,考虑磨料流介质的剪切稀化、回弹等流变特性,研究平板类工件表面的材料去除不一致性问题.
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