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Indexed by:期刊论文

Date of Publication:2009-04-01

Journal:MATERIALS AND MANUFACTURING PROCESSES

Included Journals:SCIE、EI

Volume:24

Issue:4

Page Number:504-508

ISSN No.:1042-6914

Key Words:AFM; Al2O3 powder; Berkovich indenter; CdZnTe; Chemical mechanical polishing; Cutting speed; In-situ scanning; Lapping; Nanocutting; Nanoindenter; Nanosphere; Polishing slurry; SiO2; Soft brittle materials; TEM

Abstract:(111), (110) Cd0.96Zn0.04Te, and (111) Cd0.9Zn0.1Te single crystals were lapped and polished by Al2O3 powder and SiO2 nanosphere, respectively. The ultrasmooth and damage-free surface with Ra of 1.96nm is achieved. The nanocutting process was conducted by a Berkovich indenter. When a cutting speed is 10m/s and applied load is 10N, the surface roughness Ra of (111) Cd0.96Zn0.04Te is 0.22nm. The results show that lapping, chemical mechanical polishing, and nanocutting composite process is suitable for the machining of soft brittle materials.