Current position: Home >> Scientific Research >> Patents

一种软脆功能晶体磨削加工方法

Hits:

First Author:zhangzhenyu

Disigner of the Invention:Dongming Guo,HANG GAO,Renke Kang,jinzhuji

Affilication of Author(s):机械工程学院

Application Number:CN101376228

Authorization number:CN200810013509.4

Pre One:一种电缆线与销管腔触点偶和金属接头钎焊的方法及装置

Next One:零件被加工表面几何误差的刀位规划补偿方法