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一种硬脆晶体基片的无损伤磨削方法

Release Time:2022-10-19  Hits:

First Author: Dongming Guo

Disigner of the Invention: 田业冰,Renke Kang,金洙吉,HANG GAO

Institution: 机械工程学院

Application Number: CN1958233

Authorization Number: CN200610134249.7

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