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一种硬脆晶体基片的无损伤磨削方法

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First Author:Dongming Guo

Disigner of the Invention:田业冰,Renke Kang,jinzhuji,HANG GAO

Affilication of Author(s):机械工程学院

Application Number:CN1958233

Authorization number:CN200610134249.7

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