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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 精密与特种加工教育部重点实验室 副主任； 中国光整加工专业委员会 主任委员； 中国生产工程学会 常务理事； 中国国际磨粒加工技术学会（ICAT）常务理事
性别：男
毕业院校：东北工学院
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院知方楼7185室
联系方式：0411-84706138 gaohang@dlut.edu.cn
电子邮箱：gaohang@dlut.edu.cn
Investigation on the dressing shape of vacuum chuck in wafer rotation grinding
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论文类型：期刊论文
发表时间：2005-05-20
发表刊物：ADVANCES IN ABRASIVE TECHNOLOGY VIII
收录刊物：SCIE、EI、Scopus
卷号：291-292
页面范围：171-176
ISSN号：1013-9826
关键字：silicon wafers; vacuum chuck; dressing shape; ultra-precision grinding; IC
摘要：During wafer rotation grinding, the wafer is centered on a porous ceramic vacuum chuck and so; the dressing shape of vacuum chuck becomes a critical factor affecting the flatness of ground wafers. In this paper, a theoretical model of the dressing shape of vacuum chuck in wafer rotation grinding is developed. From the model, the relationship between the dressing shape and the affecting factors is given. The dressing shape is predicted by computer simulations based on theoretic model and the vacuum chuck dressing experiments are conducted to verify the theoretical model. It is shown that the theoretical analysis matches the experimental measuring results very well. The study results provide a theoretical basis for analysis of the relationship between the dressing shape and the flatness of ground wafer, for improving the flatness of ground wafer and for selecting the proper parameters of grinding process.