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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 精密与特种加工教育部重点实验室 副主任； 中国光整加工专业委员会 主任委员； 中国生产工程学会 常务理事； 中国国际磨粒加工技术学会（ICAT）常务理事
性别：男
毕业院校：东北工学院
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院知方楼7185室
联系方式：0411-84706138 gaohang@dlut.edu.cn
电子邮箱：gaohang@dlut.edu.cn
A New High-Efficiency and Low-Damage Polishing Process of HgCdTe Wafer
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论文类型：期刊论文
发表时间：2012-02-01
发表刊物：MATERIALS AND MANUFACTURING PROCESSES
收录刊物：SCIE、EI
卷号：27
期号：2
页面范围：229-232
ISSN号：1042-6914
关键字：Dmage; HgCdTe; Mechanism; Polishing; Removal; Roughness; Slurry; Subsurface; Surface
摘要：HgCdTe crystals have been accepted as a very important material of infrared detectors, and due to their soft-brittle nature, machining HgCdTe wafers is a challenge in the field of ultraprecision manufacture. In this article, the new polishing slurry is developed, and the new polishing process is employed to polish HgCdTe wafers; the polishing results showed that the polished surface roughness Ra is as small as 0.32 nm, the polished surface is smooth and flat, and the subsurface damage only contains thin amorphous layer with depth of 3 nm. The material removal mechanism during polishing HgCdTe wafers is that HgCdTe react with oxidant and acid in the polishing slurry, and at last, the polished surfaces are covered with HgCdTe and TeO2.