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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 精密与特种加工教育部重点实验室 副主任； 中国光整加工专业委员会 主任委员； 中国生产工程学会 常务理事； 中国国际磨粒加工技术学会（ICAT）常务理事
性别：男
毕业院校：东北工学院
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院知方楼7185室
联系方式：0411-84706138 gaohang@dlut.edu.cn
电子邮箱：gaohang@dlut.edu.cn
Damage mechanisms during lapping and mechanical polishing CdZnTe wafers
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论文类型：期刊论文
发表时间：2010-06-01
发表刊物：RARE METALS
收录刊物：SCIE、EI、CSCD
卷号：29
期号：3
页面范围：276-279
ISSN号：1001-0521
关键字：lapping; mechanical polishing; wafers; surface; subsurface; abrasive
摘要：CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated. The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embedded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.