点击次数：

论文类型：期刊论文

发表时间：2010-01-01

发表刊物：JOURNAL OF THE ELECTROCHEMICAL SOCIETY

收录刊物：SCIE、EI、Scopus

卷号：157

期号：9

页面范围：II853-II856

ISSN号：0013-4651

摘要：Abrasive-free polishing (AFP) has been developed for processing of soft, hygroscopic KH(2)PO(4) (KDP) crystal according to its deliquescence property. A new nonaqueous abrasive-free slurry, composed of water, dodecanol, and Triton X-100, is designed for the AFP process. In this slurry, the function of water, which is enveloped into surfactant micelles and has no direct contact with KDP crystal in the absence of polishing pressure, is to dissolve KDP surface material in the AFP. The experiments show that the material removal rate (MRR) is nonlinearly dependent on polishing pressure and platen speed; MRR as high as 700 nm min(-1) at certain polishing condition and a scratch-free polished KDP surface with root-mean-square roughness lower than 2 nm are achieved by the AFP process. Moreover, the repeat utilization times of the slurry are experimentally determined in KDP AFP with a relatively high removal rate and a smooth surface. (C) 2010 The Electrochemical Society. [DOI:10.1149/1.3458869] All rights reserved.