论文名称：采用HF酸浸蚀沉降的方法从单晶硅切割废浆料中回收硅粉
发表刊物：功能材料
所属单位：材料科学与工程学院
期号：11
页面范围：1479-1481,1485
ISSN号：1001-9731
摘要：HF acid etching sedimentation process was designed to recycling of silicon from cutting slurry waste in poly-silicon slicing process.The effects of several operational variables on the recovery rate and yield of silicon kerfs were systematically investigated,including HF acid concentration,HF processing time.Also the effects of dispersion time of ultrasonic agitation prior to the HF acid etching sedimentation process were also studied.In considering the acceptable levels of both recovery rate and yield,a product with Si recovery rate of 82wt% and the yield 62% is obtained under the operating conditions by setting HF acid concentration at 2%,HF processing time at 24h,the agitation time at 60min.It is indicated that through this method we can recycle the Si powder from slurry waste.
备注：新增回溯数据
发表时间：2012-01-01