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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2010-01-01

发表刊物：JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME

收录刊物：Scopus、EI、SCIE

卷号：132

期号：1

页面范围：1-6

ISSN号：0022-1481

关键字：calorimetry; copper; metallic thin films; specific heat

摘要：This paper presents a micropulse calorimeter for heat capacity measurement of thin films. Optimization of the structure and data processing methods of the microcalorimeter improved the thermal isolation and temperature uniformity and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films, the data shows that the specific heat increases with the decreasing of film thickness (or the average crystalline size).