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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2012-11-01

发表刊物：JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

收录刊物：Scopus、EI、SCIE

卷号：212

期号：11

页面范围：2315-2320

ISSN号：0924-0136

关键字：Multilayer microfluidic chip; Embedded sacrificial layer; Laser edge welding; PMMA

摘要："Reservoir unsealed" and "boundary layer separation" are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems. (C) 2012 Elsevier B.V. All rights reserved.