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论文类型：会议论文

发表时间：2016-04-18

收录刊物：EI、CPCI-S

卷号：42

页面范围：842-846

关键字：USM; Micromachining; Quartz crystal; Surface roughness; Material removal mode

摘要：Micro ultrasonic machining (USM) is widely utilized to produce micro-scale parts and products in hard and brittle materials such as silicon, ceramic and glass. The material removal modes have significant influence on the surface quality. It was found there are two types of material removal modes, brittle and ductile, existing in micro USM of silicon. It is necessary to identify the material removal modes of quartz crystal by micro USM. In this paper, Z-cut samples of quartz crystals are used as the experimental material. Extensive experiments are carried out in a set of self-developed micro USM equipment. It was found that the surface roughness, R-pk, could identify the material removal modes of quartz crystal by micro USM. When the R-pk is less than 350nm, the machined surface by micro USM is relatively smooth, indicating ductile machining. Otherwise, the machined surface is covered with sharp tips and cracks. The brittle-ductile transition mode is not obvious in the Z-cut samples of quartz crystals by micro USM. (C) 2016 The Authors. Published by Elsevier B.V.