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论文类型：期刊论文

发表时间：2009-01-01

发表刊物：CIRP ANNALS-MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI

卷号：58

期号：1

页面范围：213-216

ISSN号：0007-8506

关键字：Micromachining; EDM; High aspect ratio micro-hole

摘要：When a micro-hole is drilled deeply by EDM, the viscous resistance in the narrow discharge gap causes difficulty in the removal of debris and bubbles from the working area, leading to frequent occurrences of abnormal discharges and resulting in extensive electrode wear. This paper presents a new method of drilling high aspect ratio micro-holes by EDM, in which the planetary movement of an electrode, with enhancement from ultrasonic vibration, provides an unevenly distributed gap for the debris and bubbles to escape from the discharge zone easily. Micro-holes with aspect ratio of 29 have been drilled. (C) 2009 CIRP.