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Indexed by:期刊论文

Date of Publication:2009-10-01

Journal:Cailiao Kexue yu Gongyi/Material Science and Technology

Included Journals:EI、PKU、ISTIC、Scopus

Volume:17

Issue:SUPPL. 1

Page Number:83-87

ISSN No.:10050299

Abstract:Three kind of soldering alloys of Mg/Al were designed for a good joint microstructure. Then the influence of solder elements to microstructure and fracture morphology was investigated. Joint microstructure and fracture morphology were observed by scanning electron microscope and phase compositions were analyzed by X-ray diffraction. Research indicated that the diffusion of base metals participated in the joint formation, which indicated that high brazing temperature and elements content of Mg or Al in solder alloy would accelerate the brittle intermetallics between Mg/Al. Soldering temperature of Sn-Zn was far lower than the reaction temperature, thereby the diffusion between Mg/Al was restricted and the formation of brittle intermetallics was avoided. Soldering with Sn-Zn alloy was succeeded in joining Mg/Al.