Release Time:2021-03-12 Hits:
First Author: 张兆栋
Disigner of the Invention: 刘黎明,宋刚,王红阳,孙传阳,仲德平
Application Number: CN201711444210.X
Authorization Date: 2017-12-27
Authorization Number: CN108161297A
Prev One:一种金属材料与树脂基复合材料焊铆复合连接方法
Next One:一种T型结构件双激光诱导电弧穿透焊接方法及焊接装置