Current position: Home >> Scientific Research >> Patents

一种T型结构件双激光诱导电弧穿透焊接方法及焊接装置

Release Time:2022-10-19  Hits:

First Author: 刘黎明

Disigner of the Invention: 宋刚,王红阳,史吉鹏

Institution: 材料科学与工程学院

Application Number: CN108453388A

Authorization Number: CN201810384954.5

Prev One:T型结构件双激光-电弧复合焊接方法

Next One:一种焊缝加强型搅拌摩擦焊方法