Hits:

Indexed by:Journal Papers

Date of Publication:2020-02-01

Journal:STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION

Included Journals:EI、SCIE

Volume:61

Issue:2

Page Number:555-573

ISSN No.:1615-147X

Key Words:Layout optimization; Embedded components; Embedded holes; SIMP

Abstract:In this paper, the layout optimization problem of continuum structures embedded with movable components and holes simultaneously is solved for the first time. We propose a new methodology for the embedding problem under SIMP-based computational framework, where the positions and orientations of embedded components and holes and the topology of connecting structure are optimized concurrently to maximize the overall stiffness. To this end, the parameterized topology description function, combining the Kreisselmeier-Steinhauser (KS) function, is used to construct the geometric shapes of embedded components and holes. The material density defining the topology of connecting structure and the geometric parameters used to describe the location and orientation of embedded components and holes are considered as design variables of the optimization problem. To unite these two seemingly different representations into a single computational framework, we first project the embedded components and holes into two density fields on a fixed grid using a smoothed Heaviside function, then introduce a new SIMP-motivated material interpolation scheme invoked at the finite element level for material parameterization. The material parameterization scheme supports full analytical sensitivities, which can greatly improve the accuracy and efficiency of sensitivity analysis, and make it suitable for use with efficient gradient-based algorithms. Finally, the effectiveness of the proposed method is illustrated by several numerical examples.