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Indexed by:期刊论文

Date of Publication:2013-07-01

Journal:MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Included Journals:SCIE、EI

Volume:574

Page Number:218-225

ISSN No.:0921-5093

Key Words:Electrically-assisted deformation; Electroplasticity; Grain boundaries; Intergranular cavitation; Grain boundary melting

Abstract:The influence of grain size and grain boundaries on the thermal and mechanical behavior of 70/30 brass was studied during tension tests in which electric current was applied in conjunction with mechanical deformation. Decreasing grain size was observed to increase Joule heating and increase stress reductions during electrically-assisted deformation. Additionally, a larger decrease in material flow stress was observed in electrically-assisted tests compared to oven-heated thermal tension tests at similar temperatures, however, at a different heating rate supporting that the presence of an additional electrical-mechanical interaction during electrically-assisted deformation might be time sensitive. Observations of microstructure revealed the occurrence of local intergranular cavitation as well as a new phenomenon not yet associated with electrically-assisted deformation, local grain boundary melting, during high current density experiments. These results provide additional discussion materials for the enhanced plastic deformation associated with electrically-assisted deformation. (C) 2013 Elsevier B.V. All rights reserved.