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论文类型：期刊论文

发表时间：2020-02-01

发表刊物：STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION

收录刊物：EI、SCIE

卷号：61

期号：2

页面范围：555-573

ISSN号：1615-147X

关键字：Layout optimization; Embedded components; Embedded holes; SIMP

摘要：In this paper, the layout optimization problem of continuum structures embedded with movable components and holes simultaneously is solved for the first time. We propose a new methodology for the embedding problem under SIMP-based computational framework, where the positions and orientations of embedded components and holes and the topology of connecting structure are optimized concurrently to maximize the overall stiffness. To this end, the parameterized topology description function, combining the Kreisselmeier-Steinhauser (KS) function, is used to construct the geometric shapes of embedded components and holes. The material density defining the topology of connecting structure and the geometric parameters used to describe the location and orientation of embedded components and holes are considered as design variables of the optimization problem. To unite these two seemingly different representations into a single computational framework, we first project the embedded components and holes into two density fields on a fixed grid using a smoothed Heaviside function, then introduce a new SIMP-motivated material interpolation scheme invoked at the finite element level for material parameterization. The material parameterization scheme supports full analytical sensitivities, which can greatly improve the accuracy and efficiency of sensitivity analysis, and make it suitable for use with efficient gradient-based algorithms. Finally, the effectiveness of the proposed method is illustrated by several numerical examples.