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论文类型：期刊论文

发表时间：2015-01-01

发表刊物：CIRP ANNALS-MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI

卷号：64

期号：1

页面范围：349-352

ISSN号：0007-8506

关键字：Surface integrity; Grinding; Silicon

摘要：This study investigates diamond scratching at a high speed comparable to that in a grinding process on an ultraprecision grinder. Diamond tips are prepared for the study. The scratched silicon wafer is observed for changes in the surface layer with transmission electron microscopy. The observation discovers that an amorphous layer is formed on top of the pristine Si-I phase before the onset of chip formation. This discovery is different from the previous findings in which a damaged silicon layer is identified underneath the amorphous layer. Furthermore, no high pressure phase is found before the onset of chip formation. (C) 2015. CIRP.