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论文类型：期刊论文

发表时间：2012-04-01

发表刊物：TRIBOLOGY LETTERS

收录刊物：SCIE、EI

卷号：46

期号：1

页面范围：95-100

ISSN号：1023-8883

关键字：Non-ferrous alloys; Grinding; SEM; TEM; Wear mechanisms

摘要：Damage-free subsurfaces of soft-brittle HgCdTe (MCT) single crystals were directly achieved after nanogrinding by a developed ultrafine diamond wheel. This is different from those of hard-brittle semiconductors, where there is usually a damaged layer found after mechanical machining. Two chips induced by nanogrinding with thicknesses varying from 23 to 27.1 nm attached on the ground MCT surface were observed, which is consistent well with a proposed model of chip thickness. Nanoscale material removal mechanism was investigated using high resolution transmission electron microscopy. Twins and nanocrystals were observed within the chips found.