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Indexed by:期刊论文

Date of Publication:2017-12-01

Journal:JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Included Journals:Scopus、SCIE、EI

Volume:17

Issue:12

Page Number:8975-8980

ISSN No.:1533-4880

Key Words:PDMS Nano-Mold; SiNx; Numerical Simulation; PECVD

Abstract:T-NIL (Thermal imprint lithography) is a promising technology to fabricate low-cost, high-throughput, and high resolution nano-structures in the polymer substrates. However, the foremost issues during T-NIL are the development of a low-cost and concise nano-mold fabrication method and improvement of the nano-mold lifetime. In this paper, the stress distribution in the nano-mold was studied by numerical simulation method and the fracture mechanism of the nano-mold was proposed. According to the simulation results, a fillet in the bottom of the nano-mold can significantly increase the lifetime of the nano-mold. Therefore, a top fillet SiNx nano-mold with low-cost was fabricated by SiNx deposition method, and then the bottom fillet PDMS nano-mold with 330 nm wide and 1.3 mu m deep nanochannels was replicated by casting mold method. During SiNx deposition, the ratio of high frequency and low frequency and deposition temperature were optimized. The SiNx film with small compressive stress of 75.7 MPa can be deposited on the Si substrate.