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Indexed by:期刊论文

Date of Publication:2018-01-01

Journal:JOURNAL OF ELECTRICAL ENGINEERING-ELEKTROTECHNICKY CASOPIS

Included Journals:SCIE

Volume:69

Issue:1

Page Number:72-78

ISSN No.:1335-3632

Key Words:microfluidic chip; tape assist bonding; numerical simulation

Abstract:With the development of the microstructure fabrication technique, microfluidic chips are widely used in biological and medical researchers. Future advances in their commercial applications depend on the mass bonding of microfluidic chip. In this study we are presenting a simple, low cost and fast way of bonding microfluidic chips at room temperature. The influence of the bonding pressure on the deformation of the microchannel and adhesive tape was analyzed by numerical simulation. By this method, the microfluidic chip can be fully sealed at low temperature and pressure without using any equipment. The dye water and gas leakage test indicated that the microfluidic chip can be bonded without leakage or block and its bonding strength can up to 0.84 MPa.