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Indexed by:期刊论文

Date of Publication:2016-08-01

Journal:JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Included Journals:SCIE、EI、Scopus

Volume:16

Issue:8

Page Number:8439-8444

ISSN No.:1533-4880

Key Words:1D Nanofluidic Chip; O-2 Plasma and Water Treatment; Thermal Bonding; PMMA; Rhodamine Filling Test

Abstract:1D (one dimensional) nanofluidic chips with 1D nanochannels are becoming increasingly important for biological and chemical applications. However, the majority of the present fabrication methods suffer from high dimension loss and low bonding strength. To address these issues, a new thermal bonding technique based on O-2 plasma and water treatment was developed. By this technique, the 1D PMMA nanofluidic chip can be bonded at low bonding temperature of 85 degrees C, bonding pressure of 0.3 MPa and bonding time of 15 min. The O-2 plasma parameters and thermal bonding parameters were also optimized during bonding process to further increase the bonding rate and bonding strength of the chip. The experiment results show that the bonding rate and bonding strength can be 95.3% and 0.438 MPa, respectively. The Rhodamine filling test demonstrates that there is no leakage and block in the entire 1D PMMA nanofluidic chip.