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Indexed by:期刊论文

Date of Publication:2012-06-01

Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Included Journals:SCIE、EI、Scopus

Volume:60

Issue:9-12

Page Number:933-938

ISSN No.:0268-3768

Key Words:Ultrafine diamond grinding wheel; Nanogrinding; HgCdTe; Ceramic bond

Abstract:Nanogrinding experiments on soft-brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel. The experimental results showed that the ultrafine grinding wheel exhibited excellent grinding performance on HgCdTe wafers. Surface roughness Ra 1.4 nm, rms 1.7 nm, and PV 10.9 nm were respectively achieved under nanogrinding using this diamond grinding wheel. All the ground surfaces of MCT wafers exhibited ductile mode character, free of cracking and burn damage. The nanogrinding results were discussed in terms of the ceramic bond, as well as maximum undeformed chip thickness.