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Indexed by:会议论文
Date of Publication:2015-08-16
Page Number:149-149
Key Words:胶接接头;力学性能;行为建模;结构胶黏剂;力学属性;数值仿真;环境因子;
Abstract:首先通过实验室模拟的方法研究了结构胶黏剂和单搭接胶接接头试件在长期湿-热-力耦合工况下的力学性能退化行为,得到了其依赖于环境因子的材料力学属性,并为随后的数值仿真工作提供了必要的数据.
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