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论文类型：会议论文

发表时间：2011-05-23

收录刊物：EI、Scopus

卷号：12

摘要：Earphone design process often involves selecting receivers, style and dimensions of sound tubes, and damping used in the tubes. Currently, this is largely a trial-and-error process in the field, especially when multiple drivers are used. The response characteristics of current earphone designs thus heavily rely on designers' experiences. This study is concerned with the development of a modeling approach to aid the earphone design process. During the model development, it is assumed that the earphone response is measured inside an earcoupler (e.g., IEC 60711). Furthermore, it is also assumed that the dynamic characteristics of the selected receiver(s) and the impedance of the terminal earcoupler are known. As a modular approach, each element is modeled as a four-pole network (FPN) using the electrical transmission line theory. All elements are then connected, in series or parallel depending on the actual structure, to form the whole earphone model. With this model, it is convenient to change parameters and predict the response based on the selected structural features, including the sound tubes and damping values, between the receiver(s) and the earcoupler. A design case is provided to illustrate the model application. ? 2011 Acoustical Society of America.