location： Current position: Home >> Scientific Research >> Paper Publications

Mechanism of Adhesion Particle Removal Using Supercritical CO2 and Simulation of Deep Groove Cleaning in Semiconductor

Hits:

Date of Publication:2025-10-25

Journal:LANGMUIR

Volume:41

Issue:16

Page Number:10590-10604

ISSN No.:0743-7463

Key Words:COLLOIDAL PARTICLES; CONTACT DEFORMATIONS; DETACHMENT; HAMAKER CONSTANTS; SURFACE

Pre One:Design of novel bracket structure for falling film devolatilizer and numerical simulation of its film-forming property

Next One:Geometry Optimization and Performance Prediction of Printed Circuit Heat Exchanger for Supercritical Methane
Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep