Mechanism of Adhesion Particle Removal Using Supercritical CO2 and Simulation of Deep Groove Cleaning in Semiconductor
Release Time:2025-10-28 Hits:
Indexed by: Journal Papers
Document Code: 583281
Date of Publication: 2025-04-16
Journal: LANGMUIR
Volume: 41
Issue: 16
Page Number: 10590-10604
ISSN: 0743-7463
Key Words: COLLOIDAL PARTICLES; CONTACT DEFORMATIONS; DETACHMENT; HAMAKER CONSTANTS; SURFACE