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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：光电工程与仪器科学学院副院长
其他任职：Faculty director of Instrumentation Science
性别：男
毕业院校：日本富山大学
学位：博士
所在单位：光电工程与仪器科学学院
学科：微电子学与固体电子学. 测试计量技术及仪器
办公地点：厚望楼 318
联系方式：chen_xm@dlut.edu.cn 0411-84706660
电子邮箱：chen_xm@dlut.edu.cn
A contrast between rule-based and model-based dummy metal fill in ASIC design
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论文类型：会议论文
发表时间：2010-01-01
收录刊物：EI、Scopus
期号：PART 2
页面范围：601-606
摘要：Chemical-mechanical polishing (CMP) is an essential process in deep-submicrometer LSI manufacturing to achieve Chip's planarization. It includes two processes: back-end-of-line (BEOL) and front-end-of-line (FEOL). We focus the problem on BEOL in 65nm Copper Process. Through model-based dummy metal fill is becoming a tendency recently, we proved that rule-based dummy fill is appropriate still. We apply the improved rule-based dummy fill into a middle scale design. We investigated the oxide and metal thickness, the capacitance variation and variation of layout data size. The result show that improved rule-based dummy fill is still effective in 65nm process, and model-based dummy fill is not better than the rule-based obviously. ? 2010 IEEE.