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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别：男
毕业院校：日本东北大学
学位：博士
所在单位：材料科学与工程学院
电子邮箱：w-dong@dlut.edu.cn
Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
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论文类型：期刊论文
发表时间：2017-08-01
发表刊物：JOURNAL OF MATERIALS RESEARCH
收录刊物：Scopus、SCIE、EI
卷号：32
期号：16
页面范围：3128-3136
ISSN号：0884-2914
摘要：By reflowing Cu/Sn/Ni ultrafine interconnects under a temperature gradient, a new transient liquid phase (TLP) bonding process was proposed for three-dimensional packaging applications. The evolution of the dominant (Cu,Ni)(6)Sn-5 intermetallic compounds depends strongly on the temperature gradient. The essential cause of such dependence is attributed to the different amounts of Cu and Ni atomic fluxes being introduced into the liquid solder. Under the coupling effect of thermomigration and Cu-Ni cross-interaction, the total atomic flux of Cu and Ni is promoted. As a result, the growth of dense (Cu,Ni)(6)Sn-5 is significantly accelerated and the formation of Cu3Sn is eliminated. The new TLP bonding process consumes only a limited amount of the Ni substrate, but much more from the Cu substrate. The mechanism for the new TLP bonding process is discussed and experimentally verified in this study.