Jianjun Sha
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Paper Publications
Numerical Studies of Infiltration Dynamics of Liquid-Copper and Silicon/Solid-Carbon System
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Indexed by:期刊论文

Date of Publication:2014-06-01

Journal:JOM

Included Journals:SCIE、EI

Volume:66

Issue:6

Page Number:953-959

ISSN No.:1047-4838

Abstract:Mathematical modeling of infiltration dynamics of liquid Cu-Si alloy into porous carbon is presented. Two-dimensional infiltration equations are developed using the Washburn equation in the limit of both interface and diffusion control, for situations where the capillary radius decreases either linear or parabolic, and the contact angles are assumed to exponentially decrease with time during infiltration. One major manufacturing process for the Cu-Si/C composites is liquid melt infiltration. This article focuses on nonequilibrium wetting effects and offers a fundamental approach to these complex kinetic phenomena.

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Gender:Male

Alma Mater:日本京都大学

Degree:Doctoral Degree

School/Department:力学与航空航天学院

Discipline:Aerospace Mechanics and Engineering. Materials Science

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