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基于SnAgCu无铅焊料的可变温度合金焊接技术研究

Release Time:2022-08-01  Hits:

Leading Scientist: 谷俊峰

Project Participants: 李征,阮诗伦

Project Source: 企事业单位委托科技项目

Status: 在研

Supported by: ZTE Corporation

Nature of Project: 横向

Date of Project Approval: 2022-07-01

Scheduled Completion Time: 2023-06-30

Date of Project Initiation: 2022-07-01

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