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基于SnAgCu无铅焊料的可变温度合金焊接技术研究

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Leading Scientist:谷俊峰

Project Participants:lizheng,ruanshilun

Supported by:企事业单位委托科技项目

Status:在研

Supported by:中兴通讯股份有限公司

Nature of Project:横向

Date of Project Approval:2022-07-01

Scheduled completion time:2023-06-30

Date of Project Initiation:2022-07-01

Date of Project Completion:2023-06-30

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