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三维芯片封装互连机理及关键技术

Release Time:2023-11-08  Hits:

Leading Scientist: 赵宁

Project Participants: 乔媛媛,马浩然,刘晓英

Project Source: 省、市、自治区科技项目

Status: 在研

Supported by: Liaoning Provincial Department of Science and Technology

Nature of Project: 纵向

Project Approval Number: 2023JH2/101300181

Date of Project Approval: 2023-02-24

Scheduled Completion Time: 2024-12-31

Date of Project Initiation: 2023-01-01

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