Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging
Release Time:2019-03-11 Hits:
Indexed by: Conference Paper
Date of Publication: 2013-08-11
Included Journals: Scopus、CPCI-S、EI
Page Number: 400-402
Key Words: Composite lead-free solder; Intermetallic compound; Growth kinetics
Abstract: The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu6Sn5 between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C and then aged at 150 degrees C. The Fe element tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.