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Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package

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Indexed by:会议论文

Date of Publication:2010-01-01

Page Number:1132-1137

Pre One:The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering

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