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发布时间：2019-03-11

论文类型：会议论文

发表时间：2013-05-18

收录刊物：Scopus、CPCI-S、EI

卷号：706-708

页面范围：138-141

关键字：Composite lead-free solder; Intermetallic compound; Gravity segregation

摘要：The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1 wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C. During soldering process, Fe particles quickly deposited in the vicinity of MC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.