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论文类型：会议论文

发表时间：2009-08-10

收录刊物：EI、CPCI-S、SCIE、Scopus

页面范围：611-+

摘要：Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5Cu-xFe(0, 0.5wt.%, 1 wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250 degrees C. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30 mu m wide where the volume percentage of Fe particles could reach 19%. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu6Sn5 and Cu3Sn during liquid-state aging and reduce the size of Cu6Sn5 particles. Some local small cracks were observed in the Cu6Sn5 particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow.