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发表时间：2022-10-07

发表刊物：大连理工大学学报

所属单位：材料科学与工程学院

期号：1

页面范围：51-57

ISSN号：1000-8608

摘要：The effects of the addition of 1% oxide powders (Al2O3, Fe2O3, SiO2, TiO2) on wetting properties, microstructure and mechanical properties of the eutectic Sn-58Bi eutectic solder were investigated. It was shown that the melting point of the composite solders remained unchanged, while the wetting properties and the shear strength of the composite solder/Cu joints increased with the addition of oxide powders. The microstructure of the solder joints and the interfacial intermetallic compound were obviously refined, and the thickness of intermetallic compound was decreased with the addition of oxide powders. In addition, the oxide additions reduced the oxidation of Bi on the joint surface, and thus the brightness of the solder joint surface was improved.

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