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论文类型：期刊论文

发表时间：2013-10-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物：SCIE、EI、Scopus

卷号：24

期号：10

页面范围：3925-3931

ISSN号：0957-4522

摘要：In the process of electronic packaging, such as flip chip technology, under bump metallization (UBM) can be consumed gradually by solder during soldering. Then dissolution of Ni, Au and Cu from UBM into the solder may change the original solder to a multicomponent one especially under the trend of miniaturization. It is quite necessary to evaluate the properties of the multicomponent solders that have new composition after soldering. In this study, the microstructure, thermal and mechanical properties of five types of multicomponent lead-free solders, i.e. Sn-2Cu-0.5Ni, Sn-2Cu-0.5Ni-0.5Au, Sn-3.5Ag-0.5Ni, Sn-3.5Ag-1Cu-0.5Ni and Sn-3.5Ag-2Cu-0.5Ni (all in wt% unless specified otherwise) were investigated. Comparison with eutectic Sn-0.7Cu, Sn-3.5Ag and Sn-3.5Ag-0.7Cu solders was made. There was no obvious difference of the melting point between the multicomponent lead-free solders and the eutectic ones. For Sn-2Cu-0.5Ni solder, Cu6Sn5 and (Cu,Ni)(6)Sn-5 intermetallic compounds (IMCs) formed. In the case of Sn-2Cu-0.5Ni-0.5Au, besides (Cu,Ni)(6)Sn-5, (Cu,Au)(6)Sn-5 and (Cu,Ni,Au)(6)Sn-5 were also observed. The IMCs formed in Sn-3.5Ag-0.5Ni solder were Ag3Sn and Ni3Sn4. In both Sn-3.5Ag-1Cu-0.5Ni and Sn-3.5Ag-2Cu-0.5Ni solders, Ag3Sn and (Cu,Ni)(6)Sn-5 were detected. The mechanism for the formation of the IMCs was discussed. Tensile test was also conducted. The fractography indicated that all of the multicomponent lead-free solders exhibited a ductile rupture.